{"product_id":"high-frequency-characterization-of-electronic-packaging-hardcover","title":"High-Frequency Characterization of Electronic Packaging - Hardcover","description":"\u003cdiv\u003e\u003cp style=\"text-align: right;\"\u003e\u003ca href=\"https:\/\/reportcopyrightinfringement.com\/\" target=\"_blank\" rel=\"nofollow\"\u003e\u003cb\u003eReport copyright infringement\u003c\/b\u003e\u003c\/a\u003e\u003c\/p\u003e\u003c\/div\u003e\u003cp\u003eby \u003cb\u003eLuc Martens\u003c\/b\u003e (Author)\u003c\/p\u003e\u003cp\u003e\u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. \u003cbr\u003e \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. \u003cbr\u003e \u003cem\u003eHigh-Frequency Characterization of Electronic Packaging\u003c\/em\u003e is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.\u003c\/p\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eNumber of Pages:\u003c\/strong\u003e 158\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eDimensions:\u003c\/strong\u003e 0.67 x 9.57 x 6.33 IN\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003eIllustrated:\u003c\/strong\u003e Yes\u003c\/div\u003e\n            \u003cdiv\u003e\n\u003cstrong\u003ePublication Date:\u003c\/strong\u003e October 31, 1998\u003c\/div\u003e\n            ","brand":"BooksCloud","offers":[{"title":"Default Title","offer_id":53344747258163,"sku":"9780792383079","price":185.18,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0300\/5595\/6612\/files\/qvnOP2gusf9780792383079.webp?v=1778731936","url":"https:\/\/www.vysn.com\/en-ca\/products\/high-frequency-characterization-of-electronic-packaging-hardcover","provider":"VYSN","version":"1.0","type":"link"}