BooksCloudSKU: 9780367635886
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Paperback
$136.58
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$136.58
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Paperback
$136.58
/
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Paperback
$136.58
/
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by Ephraim Suhir (Author)
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
Number of Pages: 382
Dimensions: 0.84 x 9.21 x 6.14 IN
Illustrated: Yes
Publication Date: October 04, 2024
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