BooksCloudSKU: 9783725809721
Simulation and Reliability Assessment of Advanced Packaging - Hardcover
$118.56
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$118.56
Simulation and Reliability Assessment of Advanced Packaging - Hardcover
$118.56
/
Simulation and Reliability Assessment of Advanced Packaging - Hardcover
$118.56
/
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by Kuo-Ning Chiang (Guest Editor)
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.
Number of Pages: 296
Dimensions: 0.94 x 9.61 x 6.69 IN
Publication Date: April 30, 2024
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